Lei Shi Elected as a Member of the STM Board
On 16 October 2023, the newly elected
STM Board Members were announced at the Annual General Meeting. Lei Shi, the
Deputy Editor-in-Chief of Tsinghua University Press (TUP), and the Director of
both the Journal Publishing Center and Academic Publishing Center of TUP has
been elected to the designated seat representing non-Europe/US
based companies. He became the first Chinese
representative on the STM Board.
STM is the world’s leading association
of scholarly publishers, who is committed to advance trusted research for
the benefit of society，
by fostering collaboration and innovation among its members and the wider
scholarly community. It has more than 140 members from 21 countries, including
all the major commercial publishers, learned societies and university presses.
Established in 1980, Tsinghua University
Press (TUP) is a leading comprehensive higher education and professional
publisher in China. At present, TUP publishes 54 journals--18 in Chinese and 36
in English. Of these 36 journals in English, 6 are indexed by the Emerging
Sources Citation Index (ESCI) and 7 by the Science Citation Index Expanded
(SCIE). All of the 7 SCIE-indexed journals have Q1 ranking. Journal of Advanced Ceramics boasts the
highest impact factor among all ceramic journals worldwide in 2022.
The election of the STM Board Members
started this June. After nomination and voting, Lei Shi was elected as the
Non-EU/US Company seat member for a three-year term. The STM Board has a total
of 15 members. All Board Members will strive to implement the aims and
objectives of STM and be deeply involved in the execution of the administrative
and financial affairs.
Lei Shi’s being elected as STM Board Member reflects that TUP’s efforts
in academic publishing has been recognized by international peers. It also
represents a closer partnership between TUP and STM. Committed to building a
top-level global academic brand, TUP will keep up with the pace of the
international publishing industry and work together with our peers to tackle
the ongoing challenges brought by new trends and technological innovations.