Lei Shi Elected as a Member of the STM Board

On 16 October 2023, the newly elected STM Board Members were announced at the Annual General Meeting. Lei Shi, the Deputy Editor-in-Chief of Tsinghua University Press (TUP), and the Director of both the Journal Publishing Center and Academic Publishing Center of TUP has been elected to the designated seat representing non-Europe/US based companies. He became the first Chinese representative on the STM Board.

STM is the world’s leading association of scholarly publishers, who is committed to  advance trusted research for the benefit of society， by fostering collaboration and innovation among its members and the wider scholarly community. It has more than 140 members from 21 countries, including all the major commercial publishers, learned societies and university presses.

Established in 1980, Tsinghua University Press (TUP) is a leading comprehensive higher education and professional publisher in China. At present, TUP publishes 54 journals--18 in Chinese and 36 in English. Of these 36 journals in English, 6 are indexed by the Emerging Sources Citation Index (ESCI) and 7 by the Science Citation Index Expanded (SCIE). All of the 7 SCIE-indexed journals have Q1 ranking. Journal of Advanced Ceramics boasts the highest impact factor among all ceramic journals worldwide in 2022.

The election of the STM Board Members started this June. After nomination and voting, Lei Shi was elected as the Non-EU/US Company seat member for a three-year term. The STM Board has a total of 15 members. All Board Members will strive to implement the aims and objectives of STM and be deeply involved in the execution of the administrative and financial affairs.

Lei Shi’s being elected as STM Board Member reflects that TUP’s efforts in academic publishing has been recognized by international peers. It also represents a closer partnership between TUP and STM. Committed to building a top-level global academic brand, TUP will keep up with the pace of the international publishing industry and work together with our peers to tackle the ongoing challenges brought by new trends and technological innovations.