目录
第 1 章 Altium Designer 24 高级功能及应用 ................................................................ 1
67 分钟
1.1 原理图高级功能...................................................................................................................1
1.1.1 层次式原理图设计 ...................................................................................................1
1.1.2 原理图多通道的应用..............................................................................................10
1.1.3 线束的设计及应用 .................................................................................................17
1.1.4 网络表比对导入PCB.............................................................................................21
1.1.5 Reuse Blocks 的应用 ............................................................................................24
1.1.6 设计片段的使用.....................................................................................................27
1.1.7 器件页面符的应用 .................................................................................................31
1.1.8 为原理图符号链接帮助文档...................................................................................32
1.1.9 元件符号库报告的使用..........................................................................................34
1.1.10 装配变量..............................................................................................................36
1.2 PCB 高级功能 ...................................................................................................................47
1.2.1 BGA 封装的制作....................................................................................................47
1.2.2 BGA 的扇出方式....................................................................................................50
1.2.3 常见 BGA 规格的出线方式 ....................................................................................54
1.2.4 蛇形线的等长设计 .................................................................................................55
1.2.5 多个网络的自动长度调整 ......................................................................................59
1.2.6 等长的拓扑结构.....................................................................................................61
1.2.7 xSignals 等长功能 .................................................................................................65
1.2.8 From to 等长功能...................................................................................................73
1.2.9 PCB 多板互连装配设计 .........................................................................................74
1.2.10 ActiveBOM 管理..................................................................................................83
1.2.11 背钻 Back Drill 的定义及应用..............................................................................94
1.2.12 FPGA 的引脚交换功能 ........................................................................................98
1.2.13 位号的反注解功能 .............................................................................................104
1.2.14 模块复用的操作.................................................................................................107
1.2.15 PCB 布局复制的使用.........................................................................................113
1.2.16 极坐标的应用 ....................................................................................................116
1.2.17 ActiveRoute 的应用...........................................................................................119
1.2.18 拼板阵列的使用.................................................................................................122
1.2.19 在 3D 模式下体现柔性板（Flex Board） ..........................................................127
1.2.20 盲埋孔的设置 ....................................................................................................134
1.2.21 Pad/Via 模板的使用...........................................................................................136
1.2.22 缝合孔的使用 ....................................................................................................139
1.2.23 MicroVia 的设置 ................................................................................................141
目录
1.2.24 PCB 印刷电子的设置.........................................................................................143
1.2.25 元器件的推挤和交换功能 ..................................................................................147
1.2.26 PCB 机械层的无限制添加 .................................................................................148
1.3 PCB 后期文件输出 ..........................................................................................................149
1.3.1 Output job 设计数据输出 ....................................................................................149
1.3.2 Draftsman 的应用................................................................................................159
1.3.3 新的 Pick and Place 生成器 ................................................................................169
1.3.4 3D PDF 的输出 ....................................................................................................171
1.3.5 制作 PCB 3D 视频 ...............................................................................................172
1.3.6 导出钻孔图表的方法............................................................................................176
1.3.7 邮票孔的设置 ......................................................................................................177
1.3.8 Gerber 文件转换成 PCB 文件 .............................................................................179
第 2 章 设计规则的高级应用 ........................................................................................ 182
52 分钟
2.1 铺铜连接方式 ..................................................................................................................182
2.2 间距规则..........................................................................................................................187
2.3 线宽规则..........................................................................................................................191
2.4 区域规则设置 ..................................................................................................................194
2.5 阻焊规则设置 ..................................................................................................................196
2.6 内电层的规则设置 ...........................................................................................................196
2.7 Return Path 的设置.........................................................................................................199
2.8 Query 语句的设置及应用 ................................................................................................201
2.9 规则的导入和导出 ...........................................................................................................210
第 3章 层叠应用及阻抗控制........................................................................................ 213
42 分钟
3.1 层叠的添加及应用 ...........................................................................................................213
3.1.1 层叠的定义 ..........................................................................................................213
3.1.2 多层板的组成结构 ...............................................................................................214
3.1.3 层叠的基本原则...................................................................................................214
3.1.4 常见的层叠方案...................................................................................................215
3.1.5 正片和负片的概念 ...............................................................................................218
3.1.6 3W 原则/20H 原则 ...............................................................................................219
3.1.7 层叠的添加和编辑 ...............................................................................................219
3.1.8 平面的分割处理...................................................................................................222
3.1.9 平面多边形 ..........................................................................................................224
3.2 阻抗控制..........................................................................................................................225
3.2.1 阻抗控制的定义及目的........................................................................................225
VIII 目录
3.2.2 控制阻抗的方式...................................................................................................226
3.2.3 微带线与带状线的概念........................................................................................227
3.2.4 阻抗计算的相关条件与原则.................................................................................227
3.2.5 Altium Designer 的材料库 ...................................................................................227
3.2.6 阻抗计算实例 ......................................................................................................230
第 4 章 PCB 总体设计要求及规范 ................................................................................ 242
45 分钟
4.1 PCB 常见设计规范 ..........................................................................................................242
4.1.1 过孔.....................................................................................................................242
4.1.2 封装及焊盘设计规范............................................................................................244
4.1.3 走线.....................................................................................................................248
4.1.4 丝印.....................................................................................................................250
4.1.5 Mark 点................................................................................................................250
4.1.6 工艺边 .................................................................................................................251
4.1.7 挡板条 .................................................................................................................252
4.1.8 屏蔽罩 .................................................................................................................252
4.2 拼板.................................................................................................................................253
4.2.1 V-Cut 的应用 .......................................................................................................254
4.2.2 邮票孔的应用 ......................................................................................................255
4.3 PCB 表面处理工艺 ..........................................................................................................255
4.4 组装.................................................................................................................................257
4.5 焊接.................................................................................................................................257
第 5 章 EMC 设计规范.................................................................................................. 259
26 分钟
5.1 EMC 概述........................................................................................................................259
5.1.1 EMC 的定义.........................................................................................................259
5.1.2 EMC 有关的常见术语及其定义............................................................................259
5.1.3 EMC 研究的目的和意义 ......................................................................................261
5.1.4 EMC 的主要内容 .................................................................................................261
5.1.5 EMC 三要素.........................................................................................................261
5.1.6 EMC 设计对策 .....................................................................................................262
5.1.7 EMC 设计技巧 .....................................................................................................262
5.2 常见 EMC 器件................................................................................................................267
5.2.1 磁珠.....................................................................................................................267
5.2.2 共模电感..............................................................................................................268
5.2.3 瞬态抑制二极管...................................................................................................269
5.2.4 气体放电管 ..........................................................................................................271
IX 目录
5.2.5 半导体放电管 ......................................................................................................272
5.3 布局.................................................................................................................................272
5.3.1 层的设置..............................................................................................................272
5.3.2 模块划分及特殊器件布局 ....................................................................................274
5.3.3 滤波电路的设计原则............................................................................................276
5.3.4 接地时要注意的问题............................................................................................276
5.4 布线.................................................................................................................................277
5.4.1 布线优先次序 ......................................................................................................277
5.4.2 布线基本原则 ......................................................................................................277
5.4.3 布线层优化 ..........................................................................................................277
第 6 章 进阶实例：4 层 STM32 开发板 ........................................................................ 279
58 分钟
6.1 PCB 设计的总体流程 ......................................................................................................279
6.2 实例简介..........................................................................................................................280
6.3 创建项目文件 ..................................................................................................................280
6.4 位号标注及封装匹配 .......................................................................................................281
6.4.1 位号标注..............................................................................................................281
6.4.2 元件封装匹配 ......................................................................................................282
6.5 项目验证及导入...............................................................................................................283
6.5.1 项目验证..............................................................................................................283
6.5.2 原理图与 PCB 同步导入 ......................................................................................284
6.6 板框绘制..........................................................................................................................284
6.7 电路模块化设计...............................................................................................................285
6.7.1 电源流向..............................................................................................................285
6.7.2 串口 RS232/RS485 模块......................................................................................286
6.7.3 PHY芯片 DP83848 及网口 RJ45 设计 ................................................................286
6.7.4 OV2640/TFTLCD 的设计 .....................................................................................288
6.8 器件模块化布局...............................................................................................................288
6.9 PCB 层叠设置 .................................................................................................................289
6.10 PCB 布线 ......................................................................................................................291
6.10.1 创建 Class 及颜色显示....................................................................................291
6.10.2 规则设置 .........................................................................................................293
6.10.3 布线规划及连接...............................................................................................296
6.10.4 电源平面分割 ..................................................................................................296
6.10.5 走线优化 .........................................................................................................296
6.10.6 放置回流地过孔...............................................................................................297
6.10.7 添加泪滴及整板铺铜 .......................................................................................297
X 目录
6.11 PCB 设计后期处理........................................................................................................299
6.11.1 DRC 检查 ........................................................................................................299
6.11.2 器件位号及注释的调整....................................................................................299
6.12 生产文件的输出.............................................................................................................300
6.12.1 位号图输出......................................................................................................300
6.12.2 阻值图输出......................................................................................................305
6.12.3 Gerber 文件输出 .............................................................................................306
6.12.4 生成 BOM........................................................................................................312
6.13 STM32 检查表...............................................................................................................313
第 7 章 进阶实例：4 层 MT6261 智能手表................................................................... 315
77 分钟
7.1 实例简介..........................................................................................................................315
7.2 位号排列及添加封装 .......................................................................................................315
7.2.1 位号排列..............................................................................................................315
7.2.2 封装匹配..............................................................................................................317
7.3 项目验证和查错...............................................................................................................318
7.4 PCB 网表的导入..............................................................................................................318
7.5 PCB 板框的导入及定义...................................................................................................319
7.6 PCB 层叠设置 .................................................................................................................322
7.7 阻抗控制要求 ..................................................................................................................322
7.8 模块化设计......................................................................................................................326
7.8.1 CPU核心.............................................................................................................326
7.8.2 PMU 模块 ............................................................................................................326
7.8.3 Charger 模块.......................................................................................................327
7.8.4 Wi-Fi MT5931 模块..............................................................................................329
7.8.5 Speaker/Mic 模块................................................................................................330
7.8.6 马达模块..............................................................................................................331
7.8.7 LCM 模块 ............................................................................................................331
7.8.8 G-Sensor 模块.....................................................................................................331
7.8.9 USB 接口电路......................................................................................................331
7.8.10 Flash 模块 .........................................................................................................332
7.9 PCB 整板模块化布局 ......................................................................................................333
7.10 PCB 布线设计 ...............................................................................................................333
7.10.1 常见规则、Class、差分对的添加与设置.........................................................333
7.10.2 盲埋孔的设置及添加方法 ................................................................................335
7.10.3 BGA 扇孔处理.................................................................................................336
7.10.4 整体布线规划及电源处理 ................................................................................336
XI 目录
7.10.5 优化走线 .........................................................................................................336
7.11 PCB 的后期处理............................................................................................................337
7.11.1 铺铜及修铜的处理...........................................................................................337
7.11.2 整板 DRC 检查处理.........................................................................................338
7.11.3 丝印的调整......................................................................................................338
7.12 Output job 输出生产文件...............................................................................................339
7.13 MT6261 智能手表检查表...............................................................................................343
第 8 章 进阶实例：6 层全志 A64 平板计算机............................................................... 345
85 分钟
8.1 实例简介..........................................................................................................................345
8.2 板框及层叠设计...............................................................................................................347
8.2.1 板框导入及定义...................................................................................................347
8.2.2 层叠结构的确定...................................................................................................348
8.3 阻抗控制要求 ..................................................................................................................348
8.4 电路模块分析 ..................................................................................................................351
8.4.1 LPDDR3 模块 ......................................................................................................351
8.4.2 主控模块..............................................................................................................353
8.4.3 PMIC模块...........................................................................................................355
8.4.4 eMMC/NAND Flash 模块.....................................................................................358
8.4.5 Audio 模块...........................................................................................................359
8.4.6 USB 模块.............................................................................................................361
8.4.7 Micro SD 模块 .....................................................................................................361
8.4.8 Camera 模块 .......................................................................................................362
8.4.9 液晶显示模块 ......................................................................................................362
8.4.10 CTP模块...........................................................................................................363
8.4.11 Sensor 模块.......................................................................................................364
8.4.12 HDMI 模块.........................................................................................................364
8.4.13 Wi-Fi/BT 模块.....................................................................................................365
8.5 器件布局..........................................................................................................................366
8.6 规划屏蔽罩区域...............................................................................................................367
8.7 布线设计..........................................................................................................................368
8.7.1 PCB 设计规则及添加 Class.................................................................................368
8.7.2 BGA 扇出 ............................................................................................................368
8.7.3 走线整体规划及连接............................................................................................369
8.7.4 高速信号的等长处理............................................................................................369
8.7.5 大电源分割处理...................................................................................................370
8.7.6 走线改良..............................................................................................................371
XII 目录
8.8 后期处理..........................................................................................................................372
8.8.1 铺铜及挖空处理...................................................................................................372
8.8.2 DRC 检查并修正..................................................................................................373
8.8.3 调整丝印..............................................................................................................374
8.9 生产文件的输出...............................................................................................................374
8.10 A64 平板计算机检查表..................................................................................................379
XIII
