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Thermal Management of LED’s Packaging and Light Engine

Author: Chai Guangyue, Li Bo, Wang Gang, Xiang Jin
Publication Date:2018.09.01
Page Count:372

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Based on the practical engineering experiences in LED packaging and design and manufacturing of light source lamps, this book systematically discusses the basic principles and methods of thermal design, and the means to test and evaluate thermal properties; it also introduces a popular simulation software of thermal properties. This book, with the principles and thermal design of LED packaging and light source lamps as a principal axis, integrates the basic technologies of LED packaging and light source lamps, the basic theories of thermal design and simulation tools, and the relevant knowledge about testing and evaluation of LED thermal properties, so that it is able to provides readers with an all-round introduction to the basic principles and practical applications. This book can be used as a textbook or reference book for senior undergraduate students and graduate students of relevant majors, or used as a training material for the practitioners in semiconductor lighting industry and other engineering and technical staff.

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  • Chai Guangyue is professor of the School of New Energy and New Materials, Shenzhen Technology University (SZTU), and professor of SZTU’s School of Optoelectronic Engineering. After graduation from the Department of Electrical Engineering, Tsinghua University, Chai has been dedicated to research and teaching of semiconductor optoelectronic devices and application technology. Wang Gang is Senior Product Application Engineer of the MAD Department of Mentor Graphics (Shanghai). He is an expert in thermal testing of semiconductor devices. Li Bo is mainly dedicated to researching the electronic equipment cooling technology. He received his Bachelor’s Degree in Architectural Environment & Equipment Engineering from Tongji University, and Master’s Degree in Engineering Thermophysics from University of Shanghai for Science and Technology. Xiang Jin, with over 15 years of working experiences in semiconductor industry, is now taking charge of the college-related business of Mentor in in Greater China. He graduated from Tongji University with a Master’s Degree in Software Engineering and an MBA Degree.

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