In August, the first issue of Volume 31 of Tsinghua Science and Technology was released on SciOpen, an academic publishing platform developed by Tsinghua University Press. This move marks a new chapter of independent operation for the journal, following a period of collaboration with an international publishing partner.
Tsinghua Science and Technology is the first English-language journal in natural sciences sponsored by Tsinghua University. Led by Professor SUN Jiaguang, an Academician of the Chinese Academy of Engineering, who serves as Editor-in-Chief, the journal is published by Tsinghua University Press. In 2011, it was restructured to focus specifically on information science. Through more than a decade of dedicated development, the journal has enhanced its academic impact in the field, attracting a growing number of international submissions and engaging readers from more than 130 countries and regions.
SciOpen, an international digital publishing platform for scientific journals, was launched by Tsinghua University Press in June 2022. To date, the platform has published over 58,000 articles from 195 journals, with a user base spanning more than 190 countries and regions. Its global reach, stable operation and reliable services provide a solid technical foundation and a robust channel for global dissemination, ensuring strong support for the future growth of Tsinghua Science and Technology. Tsinghua Science and Technology will uphold its commitment to highlighting cutting-edge research and emerging trends in information science, further contributing to the advancement of the field.
Learn more about Tsinghua Science and Technology:
Tsinghua Science and Technology, first published in 1996, is an international academic journal sponsored by Tsinghua University. Released bimonthly, the journal aims at presenting the latest scientific advances in computer science, electronic engineering, and related IT fields. It welcomes high-quality contributions from researchers and institutions across the globe.
Official website: https://www.sciopen.com/journal/1007-0214
Submission link: https://mc03.manuscriptcentral.com/tst
